publication venue for
- A Graph-Theoretic Approach for Spatial Filtering and Its Impact on Mixed-Type Spatial Pattern Recognition in Wafer Bin Maps. 34:194-206. 2021
- Increasing the Utilization of Deep Neural Networks for SEM Measurements Through Multiple Task Formulation and Visualization. 33:322-330. 2020
- Surface Stress Evolution in Through Silicon Via Wafer During a Backside Thinning Process. 32:589-595. 2019
- Process-Machine Interaction (PMI) Modeling and Monitoring of Chemical Mechanical Planarization (CMP) Process Using Wireless Vibration Sensors. 27:1-15. 2014
- Nonlinear Sequential Bayesian Analysis-Based Decision Making for End-Point Detection of Chemical Mechanical Planarization (CMP) Processes. 24:523-532. 2011
- An Analytical Model for Conveyor-Based Material Handling System With Crossovers in Semiconductor Wafer Fabs. 23:468-476. 2010
- Treatment of organic wastewater discharged from semiconductor manufacturing process by ultraviolet/hydrogen peroxide and biodegradation. 15:540-551. 2002
- HIERARCHICAL MAPPING OF SPOT DEFECTS TO CATASTROPHIC FAULTS - DESIGN AND APPLICATIONS. 8:167-177. 1995
- Efficient scheduling policies to reduce mean and variance of cycle-time in semiconductor manufacturing plants. 7:374-388. 1994
- Defect clustering viewed through generalized Poisson distribution. 5:196-206. 1992
- Modeling and performance analysis of cluster tools using Petri nets. 11:394-403.
- Process Performance Prediction for Chemical Mechanical Planarization (CMP) by Integration of Nonlinear Bayesian Analysis and Statistical Modeling 2010
- A Simplified Design Model for Random Process Variability 2009
- Rigorous Extraction of Process Variations for 65-nm CMOS Design 2009