Surface Stress Evolution in Through Silicon Via Wafer During a Backside Thinning Process Academic Article uri icon

published proceedings

  • IEEE Transactions on Semiconductor Manufacturing

author list (cited authors)

  • Jiang, B., Chen, Y., Fang, A., Liu, B., Liu, Y., Liang, H., & Lu, X.

citation count

  • 2

complete list of authors

  • Jiang, Bocheng||Chen, Yan||Fang, Alex||Liu, Bingtong||Liu, Yuhong||Liang, Hong||Lu, Xinchun

publication date

  • November 2019