Electromigration of Plasma Etched Copper Lines of Various Widths and Lengths
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© The Electrochemical Society. Copper is the most popular interconnect material in high density ICs, large area flat panel displays, and other electronic products. The plasma-based copper etch method is effective in preparing fine interconnect lines. The lifetime of the plasma-etched copper line with respect to the width and length has been investigated using the electromigration method. Under the same current density, the lifetime increases with the reduction of line width because the wide line has more grain boundary intersection points for electromigration phenomena to occur than the narrow line does. Also, the shape of the current vs. time breakdown curve differs with the line length and width. The thin line breaks more abruptly than the wide line does due to the relatively uneven distribution of break down points in the line. This result is important to the practical application of the plasmaetched copper line in nano and microelectronics.
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