Plasma-Based Copper Etch Process and Reliability
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© The Electrochemical Society. Copper is widely used as the interconnect material in ultra-large-scale-integrated circuits. The sputter deposition process effects on the copper thin film's grain structure and resistivity have been studied. Process effects on copper lines prepared with the plasma-based etch process have also been investigated. The etched line edge roughness follows the grain structure. The lifetime of the copper line with respect to the line width was determined from the electromigration failure time. Under the constant voltage stress condition, the lifetime decreases with the decrease of the line width. The plasma-based process is effective in preparing copper fine lines.
author list (cited authors)
Gao, B., Gao, Y., Kuo, Y., & Yuan, T.