Bifurcation in deformation behavior of Cu and Ta by accumulative roll-bonding at high temperature Academic Article

abstract

• 2017 Cu and Ta are co-deformed at 673K by the accumulative roll-bonding technique up to 8 passes. At an equivalent von Mises strain (vm) of ~2 the deformation is bifurcated into shear accommodated by the soft Cu, and plane-strain by the hard-but-ductile Ta. This is attributed to transitions occurring collectively at vm ~2 in crystallographic texture, partitioning of recovery and recrystallization, and the nature of interfaces as elucidated by orientation relations, Hall-Petch behavior and manifestation of instabilities at higher strain.

authors

• Mansoor, Bilal

published proceedings

• SCRIPTA MATERIALIA

altmetric score

• 0.25

author list (cited authors)

• Mungole, T., Mansoor, B., Ayoub, G., & Field, D. P.

citation count

• 8

complete list of authors

• Mungole, Tarang||Mansoor, Bilal||Ayoub, Georges||Field, David P

publication date

• January 2017

publisher

• Elsevier  Publisher

published in

• Scripta Materialia  Journal

keywords

• Accumulative Roll Bonding
• Co-deformation
• High-temperature Deformation
• Interfaces
• Multilayers

Digital Object Identifier (DOI)

• 10.1016/j.scriptamat.2017.04.012

start page

• 87

end page

• 91

volume

• 136

URL

• http://dx.doi.org/10.1016/j.scriptamat.2017.04.012