Bifurcation in deformation behavior of Cu and Ta by accumulative roll-bonding at high temperature
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© 2017 Cu and Ta are co-deformed at 673 K by the accumulative roll-bonding technique up to 8 passes. At an equivalent von Mises strain (ɛvm) of ~ 2 the deformation is bifurcated into shear accommodated by the ‘soft’ Cu, and plane-strain by the ‘hard-but-ductile’ Ta. This is attributed to transitions occurring collectively at ɛvm ~ 2 in crystallographic texture, partitioning of recovery and recrystallization, and the nature of interfaces as elucidated by orientation relations, Hall-Petch behavior and manifestation of instabilities at higher strain.
author list (cited authors)
Mungole, T., Mansoor, B., Ayoub, G., & Field, D. P.