Immediate neighbor difference I-DDQ test (INDIT) for outlier identification Conference Paper

abstract

• 2003 IEEE. Increasing magnitude and variation in leakage current make it impossible to distinguish between faulty and fault-free chips using single threshold method. Neighboring chips on a wafer have similar fault free properties. By obtaining differences in IDDQ values it is possible to discriminate faulty dice. In this paper we describe a methodology in which comparison of IDDQ of a die with that of its neighboring dice on the wafer is evaluated for screening faulty chips at the wafer level. The analysis based on the SEMATECH test data is presented.

name of conference

• 16th International Conference on VLSI Design, 2003. Proceedings.

authors

• Walker, Duncan

published proceedings

• 16TH INTERNATIONAL CONFERENCE ON VLSI DESIGN, PROCEEDINGS

author list (cited authors)

• Sabade, S. S., & Walker, D.

citation count

• 1

complete list of authors

• Sabade, SS||Walker, DMH

publication date

• January 2003

publisher

• Institute of Electrical and Electronics Engineers (IEEE)  Publisher

published in

• Proceedings of the IEEE International Conference on VLSI Design  Journal

keywords

• Delta Iddq
• I-ddq Testing
• Spatial Correlation

Digital Object Identifier (DOI)

• 10.1109/ICVD.2003.1183163

International Standard Book Number (ISBN) 10

• 0-7695-1868-0

start page

• 361

end page

• 366

volume

• 2003-January

URL

• http%3A%2F%2Fdx.doi.org%2F10.1109%2Ficvd.2003.1183163