Immediate neighbor difference I/sub DDQ/ test (INDIT) for outlier identification Conference Paper uri icon

abstract

  • 2003 IEEE. Increasing magnitude and variation in leakage current make it impossible to distinguish between faulty and fault-free chips using single threshold method. Neighboring chips on a wafer have similar fault free properties. By obtaining differences in IDDQ values it is possible to discriminate faulty dice. In this paper we describe a methodology in which comparison of IDDQ of a die with that of its neighboring dice on the wafer is evaluated for screening faulty chips at the wafer level. The analysis based on the SEMATECH test data is presented.

name of conference

  • 16th International Conference on VLSI Design. Concurrently with the 2nd International Conference on Embedded Systems Design

published proceedings

  • 16th International Conference on VLSI Design, 2003. Proceedings.

author list (cited authors)

  • Sabade, S. S., & Walker, D.

citation count

  • 1

complete list of authors

  • Sabade, SS||Walker, DMH

publication date

  • January 2003