Broadband Impedance Matching for Inductive Interconnect in VLSI Packages
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Noise induced by impedance discontinuities from VLSI pack-aging is one of the leading challenges facing system level designers in the next decade. The performance of IC cores far exceeds that of current packaging technology. The risetimes of IC signals require that the interconnect of the package be treated as transmission lines. As a result, impedance discontinuities in the package cause reflections which may result in intermittent switching of digital signals and edge time degradation, both of which limit system performance. The major cause of the impedance discontinuity in the package is the high inductance of the wire bond interconnect. To compensate for this problem, capacitance can be placed near the wire bond to reduce its effective impedance over a given frequency range. This paper presents the application of this impedance matching technique for use in broadband digital signals that are prevalent in modern VLSI designs. Both static and dynamic compensation approaches are presented. The static compensator places pre-defined capacitances on the package and on the IC to surround the wire bond inductance. The dynamic compensator places a switchable capacitance on the IC that can be programmed to a desired value, thereby enabling the designer to overcome design and manufacturing variations in the wire bond. Both techniques presented are shown to bound the reflections of the wire bond to less than 5% (down from 20% for an uncompensated structure) for wire bonds up to 5mm in length, and for frequencies up to 3GHz. In addition, both circuits utilizes less area than a typical wire bond pad, making them ideal for placement directly beneath the wire bond pads. 2005 IEEE.
