Tensile creep of fine grained (3–5 μm) Ti3SiC2 in the 1000–1200°C temperature range
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The tensile creep behavior of fine grained TiSiC2 in the 1000 - 1200°C temperature range was discussed. The stresses occured by a combination of plastic deformation, crack formation and cavitation. The dominant deformation mechanism in the quasi-steady state creep regime was the plastic deformation Internal stresses were developed during creep that were responsible for the initiation of intergranular cracking and acceleration of the creep rate during the tertiary stage. At high testing stresses tertiary creep occured before the steady state creep was established, internal stresses developed during the primary creep have an important role in the initiation of internal cracks.
author list (cited authors)
Radovic, M., Barsoum, M. W., El-Raghy, T., & Wiederhorn, S.