Reduction of vanadium diffusivity within copper grain boundaries due to enhanced binding

authors

• Demkowicz, Michal

published proceedings

• Scripta Materialia

author list (cited authors)

• Liu, T. Y., Sheu, E., Tavakolzadeh, M., Williams, D. J., Baldwin, J. K., & Demkowicz, M. J.

complete list of authors

• Liu, TY||Sheu, E||Tavakolzadeh, M||Williams, DJ||Baldwin, JK||Demkowicz, MJ

publisher

• Elsevier  Publisher

published in

• Scripta Materialia  Journal

keywords

• 40 Engineering
• 4016 Materials Engineering
• Neurosciences

Digital Object Identifier (DOI)

• 10.1016/j.scriptamat.2024.116515

start page

• 116515

end page

• 116515

volume

• 258