Outgassing of implanted He via short circuit transport along phase and grain boundaries in vapor co-deposited Cu-W nanocomposites
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Yadav, D., Chen, P., Xiang, S., Wang, Y., Baldwin, J. K., Evans, P., ... Xie, K. Y.
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Yadav, Digvijay||Chen, Peng||Xiang, Sisi||Wang, Yongqiang||Baldwin, Jon Kevin||Evans, Peter||Williams, Nicholas||Demkowicz, Michael J||Xie, Kelvin Y
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Research
keywords
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Copper
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Grain Boundaries
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Helium
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Implantation
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Interfaces
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Nanocomposite
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Nuclear Reaction Analysis
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Precession Electron Diffraction
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Transmission Electron Microscopy
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Tungsten
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http://dx.doi.org/10.1016/j.actamat.2022.118306