Enhancement of Saturation Boiling of PF-5060 on Microporous Surface Conference Paper uri icon


  • Pool boiling experiments were conducted to investigate the saturation boiling of PF-5060 dielectric liquid on micro porous copper surface. The micro porous surface is deposited on a copper coated silicon wafer diced to a size of 40 mm 68 mm. Reference experiments were performed using a bare silicon wafer of the same size. Experiments are also performed using deionized water that was degassed prior to the experiment. The experimental results show that there is 48% enhancement of heat flux in nucleate boiling regime on the micro porous copper surface, compared to that on a bare surface for pool boiling of PF-5060. The measurement uncertainty for heat flux in these experiments is estimated to be 15%. The enhanced surface area provided by the micro porous copper surface as well as the reduction in the magnitude of the Taylor instability wavelength on a copper surface, increase in the nucleation site density on the porous surface, capillary replenishment of the dry out regions and the increase in transient heat transfer from the porous surface are postulated to be the enhancement mechanisms for the observed augmentation in heat flux values.

name of conference

  • ASME/JSME 2011 8th Thermal Engineering Joint Conference

published proceedings

  • ASME/JSME 2011 8th Thermal Engineering Joint Conference

author list (cited authors)

  • Jeon, S., Jo, B., & Banerjee, D.

citation count

  • 1

complete list of authors

  • Jeon, Saeil||Jo, Byeongnam||Banerjee, Debjyoti

publication date

  • January 2011