Toughening of interface networks through the introduction of weak links Academic Article

authors

• Demkowicz, Michal
• Srivastava, Ankit

published proceedings

• ACTA MATERIALIA

altmetric score

• 0.25

author list (cited authors)

• Chiu, E., Demkowicz, M. J., & Srivastava, A.

citation count

• 7

complete list of authors

• Chiu, Edwin||Demkowicz, Michael J||Srivastava, Ankit

publication date

• August 2021

publisher

• Elsevier  Publisher

published in

• ACTA MATERIALIA  Journal

keywords

• Crack Propagation
• Finite-element Simulations
• Intergranular Failure
• Microstructure Design
• Toughening Mechanisms

Digital Object Identifier (DOI)

• 10.1016/j.actamat.2021.117090

start page

• 117090

end page

• 117090

volume

• 215

URL

• http://dx.doi.org/10.1016/j.actamat.2021.117090