Transferwear During Cu CMP Academic Article uri icon


  • We conducted fundamental investigation of interfacial interactions between copper and polyurethane surfaces. Using in situ surface analysis techniques we were able to evaluate effects of water molecules on both materials surfaces during rubbing. Evidence of transferring elements between copper and urethane surfaces due to friction was found. Further investigation on pad wear indicated that transfer wear was taking a major role during copper CMP and mixed wear modes dominated pad wear.

published proceedings

  • MRS Advances

author list (cited authors)

  • Liang, H., Xu, G. H., Martin, J. M., & Le Mongne, T. h.

citation count

  • 5

complete list of authors

  • Liang, H||Xu, G Helen||Martin, JM||Le Mongne, Th

publication date

  • January 2003