Comparison of Staggered and In-Line V-Shaped Dimple Arrays Using S-PIV Conference Paper uri icon

abstract

  • As a result of the reduced pressure loss relative to ribs, recessed dimples have the potential to increase the thermal performance of internal cooling passages. In this experimental investigation, a Stereo-Particle Image Velocimetry (S-PIV) technique is used to characterize the three-dimensional, internal flow field over V-shaped dimple arrays. These flowfield measurements are combined with surface heat transfer measurements to fully characterize the performance of the proposed V-shaped dimples. This study compares the performance of two arrays. Both a staggered array and an in-line array of V-shaped dimples are considered. The layout of these V-shaped dimples is derived from a traditional, staggered hemispherical dimple array. The individual V-shaped dimples follow the same geometry, with depths of / D = 0.30. In the case of the in-line pattern, the spacing between the V-shaped dimples is 3.2D in both the streamwise and spanwise directions. For the staggered pattern, a spacing of 3.2D in the spanwise direction and 1.6D in the streamwise direction is examined. Each of these patterns was tested on one wide wall of a 3:1 rectangular channel. The Reynolds numbers examined range from 10000 to 37000. S-PIV results show that as the Reynolds numbers increase, the strength of the secondary flows induced by the in-line array increases, enhancing the heat transfer from the surface, without dramatically increasing the measured pressure drop. As a result of a minimal increase in pressure drop, the overall thermal performance of the channel increases as the Reynolds number increases (up to the maximum Reynolds number of 37000).

name of conference

  • Volume 5A: Heat Transfer

published proceedings

  • Volume 5A: Heat Transfer

author list (cited authors)

  • Brown, C. P., Wright, L. M., & McClain, S. T.

citation count

  • 3

complete list of authors

  • Brown, Charles P||Wright, Lesley M||McClain, Stephen T

publication date

  • June 2015