Comparison of Staggered and In-Line V-Shaped Dimple Arrays Using S-PIV Conference Paper uri icon


  • © Copyright 2015 by ASME. As a result of the reduced pressure loss relative to ribs, recessed dimples have the potential to increase the thermal performance of internal cooling passages. In this experimental investigation, a Stereo-Particle Image Vel°Cimetry (S-PIV) technique is used to characterize the three-dimensional, internal flow field over V-shaped dimple arrays. These flowfield measurements are combined with surface heat transfer measurements to fully characterize the performance of the proposed Vshaped dimples. This study compares the performance of two arrays. Both a staggered array and an in-line array of V-shaped dimples are considered. The layout of these V-shaped dimples is derived from a traditional, staggered hemispherical dimple array. The individual Vshaped dimples follow the same geometry, with depths of δ / D = 0.30. In the case of the in-line pattern, the spacing between the V-shaped dimples is 3.2D in both the streamwise and spanwise directions. For the staggered pattern, a spacing of 3.2D in the spanwise direction and 1.6D in the streamwise direction is examined. Each of these patterns was tested on one wide wall of a 3:1 rectangular channel. The Reynolds numbers examined range from 10000 to 37000. S-PIV results show that as the Reynolds numbers increase, the strength of the secondary flows induced by the in-line array increases, enhancing the heat transfer from the surface, without dramatically increasing the measured pressure drop. As a result of a minimal increase in pressure drop, the overall thermal performance of the channel increases as the Reynolds number increases (up to the maximum Reynolds number of 37000).

author list (cited authors)

  • Brown, C. P., Wright, L. M., & McClain, S. T.

citation count

  • 2

publication date

  • June 2015