A phenomenological model of polishing of silicon with diamond abrasive Academic Article

abstract

• A phenomenological model of polishing hemispherical silicon asperities with spherical diamond abrasives is presented. Removal of the asperity material is quantitatively determined by a removal rate constant K. It is based on our molecular dynamics (MD) simulation studies considering the probability of removal of asperity atoms by an abrasive. The dependence of the removal rate constant K on the diameter and velocity of abrasives, number of asperities and abrasives per unit area, and cutting depth has been investigated. The rate constant K is found to be insensitive to the density of asperities, but linearly dependent on the density of abrasives. 2009 Elsevier Ltd. All rights reserved.

authors

• Bukkapatnam, Satish

published proceedings

• TRIBOLOGY INTERNATIONAL

author list (cited authors)

• Agrawal, P. M., Narulkar, R., Bukkapatnam, S., Raff, L. M., & Komanduri, R.

citation count

• 13

complete list of authors

• Agrawal, Paras M||Narulkar, R||Bukkapatnam, S||Raff, LM||Komanduri, R

publication date

• January 2010

publisher

• Elsevier  Publisher

published in

• Tribology International  Journal

keywords

• Polishing
• Rate
• Simulation

Digital Object Identifier (DOI)

• 10.1016/j.triboint.2009.05.003

start page

• 100

end page

• 107

volume

• 43

issue

• 1-2

URL

• http://dx.doi.org/10.1016/j.triboint.2009.05.003