Making Split Fabrication Synergistically Secure and Manufacturable Conference Paper

abstract

• 2017 IEEE. Split fabrication is a promising approach to security against attacks by untrusted foundries. While existing split fabrication methods consider the overhead of conventional objectives such as wirelength and timing, they mostly neglect manufacturability - an unavoidable challenge in nanometer technologies. Observing that security and manufacturability can be addressed in a synergistic manner, this work introduces routing techniques that can simultaneously improve both security and manufacturability in terms of either Chemical Mechanical Planarization (CMP) uniformity or Self-Aligned Double Patterning (SADP) compliance. The effectiveness of these techniques is confirmed by experiments on benchmark circuits.

name of conference

• 2017 IEEE/ACM International Conference on Computer-Aided Design (ICCAD)

authors

• Rajendran, Jeyavijayan

published proceedings

• 2017 IEEE/ACM INTERNATIONAL CONFERENCE ON COMPUTER-AIDED DESIGN (ICCAD)

author list (cited authors)

• Feng, L., Wang, Y., Hu, J., Mak, W., & Rajendran, J.

citation count

• 2

complete list of authors

• Feng, Lang||Wang, Yujie||Hu, Jiang||Mak, Wai-Kei||Rajendran, Jeyavijayan JV

publication date

• January 2017

publisher

• Institute of Electrical and Electronics Engineers (IEEE)  Publisher

published in

• ICCAD / IEEE/ACM International Conference on Computer-Aided Design. IEEE/ACM International Conference on Computer-Aided Design  Journal

Digital Object Identifier (DOI)

• 10.1109/iccad.2017.8203795

International Standard Book Number (ISBN) 13

• 9781538630938

start page

• 321

end page

• 328

volume

• 2017-November