PLANARIZATION OF MULTILEVEL METALIZATION PROCESSES: A CRITICAL REVIEW. . Conference Paper uri icon

abstract

  • This paper presents a review of conventional and novel planarization processes such as Glass Flow, Etchback with or without a sacrificial layer, SOG, BSQ, polyimide, substrate-biased PECVD, and pillars. Key issues in a planarization process, e. g. , surface morphology, process simplicity and reliability, material characteristics, and etch control are discussed. A comparison of various planarization processes is tabulated. The future trend of the planarization technology is examined.

published proceedings

  • Proceedings of SPIE - The International Society for Optical Engineering

author list (cited authors)

  • Kuo, Y.

complete list of authors

  • Kuo, Y

publication date

  • December 1987