PLANARIZATION OF MULTILEVEL METALIZATION PROCESSES: A CRITICAL REVIEW. . Conference Paper

abstract

• This paper presents a review of conventional and novel planarization processes such as Glass Flow, Etchback with or without a sacrificial layer, SOG, BSQ, polyimide, substrate-biased PECVD, and pillars. Key issues in a planarization process, e. g. , surface morphology, process simplicity and reliability, material characteristics, and etch control are discussed. A comparison of various planarization processes is tabulated. The future trend of the planarization technology is examined.

authors

• Kuo, Yue

published proceedings

• Proceedings of SPIE - The International Society for Optical Engineering

author list (cited authors)

• Kuo, Y.

complete list of authors

• Kuo, Y

publication date

• December 1987

published in

• Proceedings of SPIE  Journal

International Standard Book Number (ISBN) 10

• 089252832X

start page

• 49

end page

• 60

volume

• 797