THEORETICAL STUDY OF THE ETCHBACK PLANARIZATION PROCESS. Conference Paper

abstract

• A computer modeling method was used to study various factors such as the etch time, the degree of planarization of the sacrificial layer, the original surface shape of the sacrificial layer, the etch ratio, and the original oxide step shape, that directly affect the topography of an etchback planarized surface.

authors

• Kuo, Yue

published proceedings

• Materials Research Society Symposia Proceedings

author list (cited authors)

• Kuo, Y.

complete list of authors

• Kuo, Y

publication date

• December 1987

published in

• MRS Online Proceedings Library  Journal

International Standard Book Number (ISBN) 10

• 0931837421

start page

• 209

end page

• 214

volume

• 76