Feedback controlled high frequency electrochemical micromachining
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The mostly used processes for microsystem and integrated circuitry components manufacturing are often leveraged from semiconductor technologies. Although popular in electronics, silicon does not have adequate properties for demanding applications in aerospace, mechanical, or biomedical. Fabrication using high strength metals, like stainless steel and superalloys, requires novel technologies which are different from those for silicon. A promising manufacturing method for mass producing of micro/meso scale components is electrochemical micromachining (microECM). No electrode wear, non contact process, no workpiece subsurface damage... are among the advantages of microECM. The complex system, however, requires high precision mechanical fixtures and sophisticated instrument for proper process control. This study presents a microECM system with dynamic closed-loop feedback control. The system, improves significantly material removal rate by optimizing inter electrode gap, reducing machining time, and producing higher quality microcomponents. Copyright 2008 ISA. All Rights Reserved.
author list (cited authors)
Ozkeskin, F. M., Sundarram, S. S., Allison, S., Hung, N. P., Powers, M., Strohm, G., Godinez, L. A., & Manquez, J. R.