Plasma hydrogenation - A new method of reducing the k value of the low k polyimide film
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abstract
A new method of lowering the dielectric constant (k) of a low k polyimide thin film by plasma hydrogenation has been studied. The influence of the plasma process to the material properties, such as the composition, binding energies, and bond types, and dielectric characters, such as k and leakage current, were investigated. The result showed that after hydrogenation, the film's chemical and physical structures were changed. The film's k value could be lowered to 2.3 or less and the leakage current was only slightly increased. The mechanism of the process, which is responsible for the film's material and electrical property changes, is discussed. This is an effective method in preparing dielectrics with very low k values, which is critical for the success of the multilevel interconnection structure.
