Microstructural refinement of tantalum for Nb3Sn superconductor diffusion barriers Conference Paper

abstract

• Cast pure Ta was deformation processed via equal channel angular extrusion and then recrystallized to produce a uniform, fine-grained bulk material. Extrusions were performed on 2525150 mm billets at room temperature in 90 tooling to strains of 9.3. The Vickers microhardness reaches near maximum levels after four extrusions. As-worked microstructures are composed of nonuniform submicron grains with apparent banding. A homogeneous and fine grained recrystallized microstructure (average grain size 8 m) free of banding is obtained after four extrusions via route E multipass processing and a 1000C heat treatment. The high microstructural homogeneity of such a material may exhibit better co-reduction characteristics with surrounding Cu over conventionally processed Ta for superconductor diffusion barrier applications. 2005 IEEE.

authors

• Hartwig, Karl

published proceedings

• IEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY

author list (cited authors)

• Mathaudhu, S. N., Barber, R. E., & Hartwig, K. T.

citation count

• 9

complete list of authors

• Mathaudhu, SN||Barber, RE||Hartwig, KT

publication date

• June 2005

publisher

• Institute of Electrical and Electronics Engineers (IEEE)  Publisher

published in

• IEEE Transactions on Applied Superconductivity  Journal

keywords

• Diffusion Barrier
• Multifilamentary Superconductors
• Nb3Sn
• Tantalum

Digital Object Identifier (DOI)

• 10.1109/TASC.2005.849043

start page

• 3434

end page

• 3437

volume

• 15

issue

• 2

URL

• http%3A%2F%2Fdx.doi.org%2F10.1109%2Ftasc.2005.849043