Achieving small feature microelectromechanical system (MEMS) fabrications is currently very challenging when the 3D microstructure is not feasibly compatible with conventional 2D lithography workflow. Here, we present a fabrication process using two-photon-lithography (2PP) printing with electroless plating as an alternate method of fabricating conductive 3D MEMS structures. In this process, the effect of 2PP processing parameters on SU-8 photoresist is explored. These parameters include laser power, pre-baking and post-baking temperature, and slicing and hatching distance. Aspect ratio limits were also tested, reaching a consistent aspect ratio of 12 for pillars and trenches. The fabricated MEMS device is evaluated in terms of observed accuracy and reproducibility. With the results of this research, the limitations caused by current MEMS fabrication processes will be surpassed, allowing a variety of new MEMS designs to be created.
