Tougher ultrafine grain Cu via high-angle grain boundaries and low dislocation density

Although there are a few isolated examples of excellent strength and ductility in single-phase metals with ultrafine grained (UFG) structures, the precise role of different microstructural features responsible for these results is not fully understood. Here, we demonstrate that a large fraction of high-angle grain boundaries and a low dislocation density may significantly improve the toughness and uniform elongation of UFG Cu by increasing its strain-hardening rate without any concomitant sacrifice in its yield strength. Our study provides a strategy for synthesizing tough UFG materials.

Zhao, Y. H., Bingert, J. F., Zhu, Y. T., Liao, X. Z., Valiev, R. Z., Horita, Z., ... Lavernia, E. J.

Zhao, YH||Bingert, JF||Zhu, YT||Liao, XZ||Valiev, RZ||Horita, Z||Langdon, TG||Zhou, YZ||Lavernia, EJ

Tougher ultrafine grain Cu via high-angle grain boundaries and low dislocation density Academic Article