A Direct Bond Interconnect 3D Co-Integrated Silicon-Photonic Transceiver in 12nm FinFET with -20.3dBm OMA Sensitivity and 691fJ/bit Conference Paper uri icon

abstract

  • We present the first experimental demonstration of an electronic-photonic co-designed transceiver circuit heterogeneously 3D co-integrated with high-density, low-parasitic Direct Bond Interconnect (DBI) featuring full SerDes that achieves -20.3dBm OMA sensitivity and 691fJ/bit link energy efficiency.

name of conference

  • Optical Fiber Communication Conference (OFC) 2023

published proceedings

  • Optical Fiber Communication Conference (OFC) 2023

author list (cited authors)

  • Samanta, A., Chang, P., Yan, P., Fu, M., Berkay-On, M., Kumar, A., ... Yoo, S.

complete list of authors

  • Samanta, Anirban||Chang, Po-Hsuan||Yan, Peng||Fu, Mingye||Berkay-On, Mehmet||Kumar, Ankur||Kang, Hyungryul||Yi, Il-Min||Annabattuni, Dedeepya||Zhang, Yu||Scott, David||Patti, Robert||Fan, Yang-Hang||Zhu, Yuanming||Palermo, Samuel||Yoo, SJ Ben

publication date

  • 2023