Xue, Bin (2005-12). Voltage sensing based built-in current sensor for IDDQ test. Doctoral Dissertation. Thesis uri icon

abstract

  • Quiescent current leakage test of the VDD supply (IDDQ Test) has been proven an effective way to screen out defective chips in manufacturing of Integrated Circuits (IC). As technology advances, the traditional IDDQ test is facing more and more challenges. In this research, a practical built-in current sensor (BICS) is proposed and the design is verified by three generations of test chips. The BICS detects the signal by sensing the voltage drop on supply lines of the circuit under test (CUT). Then the sensor performs analog-to-digital conversion of the input signal using a stochastic process with scan chain readout. Self-calibration and digital chopping are used to minimize offset and low frequency noise and drift. This non-invasive procedure avoids any performance degradation of the CUT. The measurement results of test chips are presented. The sensor achieves a high IDDQ resolution with small chip area overhead. This will enable IDDQ of future technology generations.
  • Quiescent current leakage test of the VDD supply (IDDQ Test) has been proven an
    effective way to screen out defective chips in manufacturing of Integrated Circuits (IC).
    As technology advances, the traditional IDDQ test is facing more and more challenges. In
    this research, a practical built-in current sensor (BICS) is proposed and the design is
    verified by three generations of test chips. The BICS detects the signal by sensing the
    voltage drop on supply lines of the circuit under test (CUT). Then the sensor performs
    analog-to-digital conversion of the input signal using a stochastic process with scan chain
    readout. Self-calibration and digital chopping are used to minimize offset and low
    frequency noise and drift. This non-invasive procedure avoids any performance
    degradation of the CUT. The measurement results of test chips are presented. The sensor
    achieves a high IDDQ resolution with small chip area overhead. This will enable IDDQ of
    future technology generations.

publication date

  • December 2005