A filament comprises a generally thin metal component, such as a sheet, ribbon, or foil. The filament comprises at least one emitter, at least one current-condensing structure and a tab on each end of the at least one emitter. Each tab is connectable to a support system, comprising for example a lead and attachment post. When a current is passed through the filament, the current-condensing structure establishes current flow through the filament resulting in a desired temperature distribution across the emitter, for example a substantially uniform temperature distribution. A predictive tool for determining a geometry of a filament to provide a desired temperature distribution is set forth. The filament may be curved, and methods and systems for providing a curved filament are also provided. Attachment systems are further disclosed for attaching an emitter to a support structure.
