A 3D Integrated Energy-Efficient Transceiver Realized by Direct Bond Interconnect of Co-Designed 12 nm FinFET and Silicon Photonic Integrated Circuits
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JOURNAL OF LIGHTWAVE TECHNOLOGY
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Chang, P., Samanta, A., Yan, P., Fu, M., Zhang, Y. u., On, M. B., ... Yoo, S.
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Chang, Po-Hsuan||Samanta, Anirban||Yan, Peng||Fu, Mingye||Zhang, Yu||On, Mehmet Berkay||Kumar, Ankur||Kang, Hyungryul||Yi, Il-Min||Annabattuni, Dedeepya||Scott, David||Patti, Robert||Fan, Yang-Hang||Zhu, Yuanming||Palermo, Samuel||Yoo, SJ Ben
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Clocks
Direct Bond Interconnect
Finfets
Integrated Optics
Optical Fibers
Optical Interconnect
Optical Receivers
Optical Transceiver
Optical Transmitters
Silicon Photonics
Transceivers
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http://dx.doi.org/10.1109/jlt.2023.3291704