A multi-scale model for coupled heat conduction and deformations of viscoelastic functionally graded materials
- Additional Document Info
- View All
An integrated micromechanical-structural framework is presented to analyze coupled heat conduction and deformations of functionally graded materials (FGM) having temperature and stress dependent viscoelastic constituents. A through-thickness continuous variation of the thermal and mechanical properties of the FGM is approximated as an assembly of homogeneous layers. Average thermo-mechanical properties in each homogeneous medium are computed using a simplified micromechanical model for particle reinforced composites. This micromechanical model consists of two isotropic constituents. The mechanical properties of each constituent are time-stress-temperature dependent. The thermal properties (coefficient of thermal expansion and thermal conductivity) of each constituent are allowed to vary with temperature. Sequentially coupled heat transfer and displacement analyses are performed, which allow analyzing stress/strain behaviors of FGM having time and temperature dependent material properties. The thermo-mechanical responses of the homogenized FGM obtained from micromechanical model are compared with experimental data and the results obtained from finite element (FE) analysis of FGMs having microstructural details. The present micromechanical-modeling approach is computationally efficient and shows good agreement with experiments in predicting time-dependent responses of FGMs. Our analysis forecasts a better design for creep resistant materials using particulate FGM composites. © 2009 Elsevier Ltd. All rights reserved.
author list (cited authors)
Khan, K. A., & Muliana, A. H.