Analytic Models to Predict Root Structure Depth Conference Paper

name of conference

• Thermosense: Thermal Infrared Applications XLII

authors

• Hsieh, Sheng-Jen

published proceedings

• THERMOSENSE: THERMAL INFRARED APPLICATIONS XLII

author list (cited authors)

• Shi, X., & Hsieh, S.

citation count

• 0

complete list of authors

• Shi, Xijin||Hsieh, Sheng-Jen Tony

editor list (cited editors)

• Oswald-Tranta, B., & Zalameda, J. N.

publication date

• January 2020

publisher

• SPIE, the international society for optics and photonics  Publisher

published in

• Proceedings of SPIE  Journal

keywords

• Artificial Neural Network (ann)
• Finite Element Analysis (FEA)
• Machine Learning
• Root Depth
• Support Vector Machine (svm)

Digital Object Identifier (DOI)

• 10.1117/12.2560771

International Standard Book Number (ISBN) 13

• 978-1-5106-3595-1

start page

• 1140904-1140904-15

volume

• 11409

URL

• http://dx.doi.org/10.1117/12.2560771