Dendrimer-Mediated Adhesion between Vapor-Deposited Au and Glass or Si Wafers. Academic Article

abstract

• Here, we report the use of amine-terminated poly(amidoamine) (PAMAM) dendrimers as adhesion promoters between vapor-deposited Au films and Si-based substrates. This method is relatively simple, requiring only substrate cleaning, dipping, and rinsing. Proof of concept is illustrated by coating glass slides and single-crystal Si wafers with monolayers of PAMAM dendrimers and then evaporating adherent, 150-nm-thick Au films atop the dendritic adhesion promoter. Scanning tunneling microscopy and cyclic voltammetry have been used to assess the surface roughness and electrochemical stability of the Au films. The effectiveness of the dendrimer adhesion layer is demonstrated using standard adhesive-tape peel tests.

authors

• Baker, Lane

published proceedings

• Anal Chem

altmetric score

• 3

author list (cited authors)

• Baker, L. A., Zamborini, F. P., Sun, L., & Crooks, R. M.

citation count

• 66

complete list of authors

• Baker, LA||Zamborini, FP||Sun, L||Crooks, RM

publication date

• October 1999

publisher

• American Chemical Society (ACS)  Publisher

published in

• Analytical Chemistry  Journal

PubMed Central ID

• 21662866

Digital Object Identifier (DOI)

• 10.1021/ac990495e

start page

• 4403

end page

• 4406

volume

• 71

issue

• 19

URL

• http://dx.doi.org/10.1021/ac990495e