Thermal-acousto-photonics for non-contact temperature measurement in silicon wafer processing Conference Paper uri icon

abstract

  • A non-contact thermometry technique has been developed to characterize the thermal state of silicon wafers during rapid thermal processing. Information on thermal variations is obtained from the dispersion relations of the propagating waveguide mode excited in wafers using a non-contact, broadband optical system referred to as Thermal Acousto-Photonics (TAP) for Non-Destructive Evaluation (NDE). Variations of thermo-mechanical properties in silicon wafers are correlated to temperature changes by performing simultaneous time-frequency analyses on Lamb waveforms acquired with a fiber-tip interferometer sensor. Experimental Lamb wave data collected for cases ranging from room temperature to 400C is presented. The results show that the temporal progressions of all spectral elements found in the fundamental antisymmetric mode are strong functions of temperature. This particular attribute is exploited to achieve a thermal resolution superior to the +/-5C attainable through current pyrometric techniques. By analyzing the temperature-dependent group velocity of a specific frequency component over the temperature range considered and then comparing the results to an analytical model developed for silicon wafers undergoing annealing, excellent agreement was obtained. Presented results demonstrate the feasibility of applying laser-induced stress waves as a temperature diagnostic during rapid thermal processing (RTP).

name of conference

  • Optical Diagnostics for Fluids/Heat/Combustion and Photomechanics for Solids

published proceedings

  • OPTICAL DIAGNOSTICS FOR FLUIDS/HEAT/COMBUSTION AND PHOTOMECHANICS FOR SOLIDS

author list (cited authors)

  • Suh, C. S., Rabroker, G. A., Chona, R., & Burger, C. P.

citation count

  • 0

complete list of authors

  • Suh, CS||Rabroker, GA||Chona, R||Burger, CP

editor list (cited editors)

  • Cha, S. S., Bryanston-Cross, P. J., & Mercer, C. R.

publication date

  • January 1999