Intrinsic stress, mismatch strain, and self-assembly during deposition of thin films subjected to an externally applied force
Academic Article
-
- Overview
-
- Research
-
- Identity
-
- Additional Document Info
-
- Other
-
- View All
-
Overview
published proceedings
-
JOURNAL OF MECHANICAL SCIENCE AND TECHNOLOGY
author list (cited authors)
citation count
complete list of authors
-
Kim, Sang-Hyun||Boyd, James G
publication date
publisher
published in
Research
keywords
-
Electrodeposition
-
Electroplated Nickel
-
Intrinsic Stress
-
Mismatch Strain
-
Self-assembly
Identity
Digital Object Identifier (DOI)
Additional Document Info
start page
end page
volume
issue
Other
URL
-
http://dx.doi.org/10.1007/s12206-008-0806-x