Adjusting to 3D Devices in a 2D Device World Conference Paper

abstract

• The challenges of device scaling and short channel effects have necessitated the close examination of 3 dimensional processing. While this certainly comes with challenges in processing and metrology, it also comes with opportunities for new device paradigms and analysis methods. We will look at an historical perspective of 3D processing and further examine how to accurately "think" 3D to achieve some of these goals and the ramifications of a few interesting device tricks that 3D processing provides. 2008 IEEE.

name of conference

• 2008 IEEE International SOI Conference

authors

• Harris, Rusty

published proceedings

• 2008 IEEE INTERNATIONAL SOI CONFERENCE, PROCEEDINGS

author list (cited authors)

• Harris, H. R., Adhikari, H., Smith, C. E., Smith, G., Yang, J., Majhi, P., & Jammy, R.

citation count

• 1

complete list of authors

• Harris, HR||Adhikari, H||Smith, CE||Smith, G||Yang, J-W||Majhi, P||Jammy, R

publication date

• October 2008

publisher

• Institute of Electrical and Electronics Engineers (IEEE)  Publisher

published in

• IEEE International SOI Conference  Journal

keywords

• 40 Engineering
• 4016 Materials Engineering
• 51 Physical Sciences

Digital Object Identifier (DOI)

• 10.1109/SOI.2008.4656321

International Standard Book Number (ISBN) 13

• 978-1-4244-1954-8

start page

• 115

end page

• +

URL

• http://dx.doi.org/10.1109/soi.2008.4656321