Plasticity in Polycrystalline Thin Films: a 2D Dislocation Dynamics Approach Academic Article

abstract

• AbstractThermal stress evolution in polycrystalline thin films is analyzed using discrete dislocation plasticity. Stress develops in the film during cooling from a stress-free configuration due to the difference in thermal expansion coefficient between the film and its substrate. A plane strain formulation with only edge dislocations is used and each grain of the polycrystal has a specified set of slip systems. The filmsubstrate interface and the grain boundaries are impenetrable for the dislocations. Results are presented for two film thicknesses, with higher hardening seen for the thinner films.

authors

• Needleman, Alan

published proceedings

• MRS Advances

author list (cited authors)

• Nicola, L., Van der Giessen, E., & Needleman, A.

citation count

• 1

complete list of authors

• Nicola, Lucia||Van der Giessen, Erik||Needleman, Alan

publication date

• January 2003

publisher

• Springer Nature  Publisher

published in

• MRS Online Proceedings Library  Journal

Digital Object Identifier (DOI)

• 10.1557/proc-779-w5.20

start page

• w5.20

volume

• 779

URL

• http://dx.doi.org/10.1557/proc-779-w5.20