Method for conformal treatment of dielectric films using inductively coupled plasma Patent uri icon


  • Disclosed are apparatus and methods for processing a substrate. The substrate having a feature with a layer thereon is exposed to an inductively coupled plasma which forms a substantially conformal layer.

author list (cited authors)

  • Pan, H., Rogers, M. S., Swenberg, J. F., Olsen, C. S., Liu, W., Chu, D., & Bevan, M. J.

publication date

  • April 2015