Au/Al Wire Bond Interface Resistance Degradation Rate Simulations Academic Article

authors

• Smith, Scott

published proceedings

• IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY

author list (cited authors)

• Ahmad, S. S., & Smith, S. C.

citation count

• 3

complete list of authors

• Ahmad, Syed Sajid||Smith, Scott C

publication date

• December 2019

publisher

• Institute of Electrical and Electronics Engineers (IEEE)  Publisher

published in

• IEEE Transactions on Device and Materials Reliability  Journal

keywords

• Diffusion
• Gold-aluminum Wire Bonds
• Interconnect Degradation
• Intermetallic Compounds
• Kirkendall Voids

Digital Object Identifier (DOI)

• 10.1109/TDMR.2019.2951685

start page

• 774

end page

• 781

volume

• 19

issue

• 4

URL

• http://dx.doi.org/10.1109/tdmr.2019.2951685