Investigation of the cure kinetics and thermal stability of an epoxy system containing cystamine as curing agent
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Overview
published proceedings
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POLYMERS FOR ADVANCED TECHNOLOGIES
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Khalafi, H. R., Ehsani, M., & Khonakdar, H. A.
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Research
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Curing Agent
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Curing Kinetics
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Cystamine
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Disulfide Bonds
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Epoxy Resin
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http://dx.doi.org/10.1002/pat.5174