Metal Capping Layer Effects on Electromigration Failure Phenomena of Plasma Etched Copper Lines
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Overview
published proceedings
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ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY
author list (cited authors)
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Su, J. Q., Li, M., & Kuo, Y.
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Su, Jia Quan||Li, Mingqian||Kuo, Yue
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keywords
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Etching
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Microelectronics
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Plasma
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Plasma Processing
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Semiconductor Processing
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URL
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http://dx.doi.org/10.1149/2162-8777/abbb71