Metal Capping Layer Effects on Electromigration Failure Phenomena of Plasma Etched Copper Lines Academic Article

authors

• Kuo, Yue

published proceedings

• ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY

author list (cited authors)

• Su, J. Q., Li, M., & Kuo, Y.

citation count

• 1

complete list of authors

• Su, Jia Quan||Li, Mingqian||Kuo, Yue

publication date

• November 2020

publisher

• The Electrochemical Society  Publisher

published in

• ECS Journal of Solid State Science and Technology  Journal

keywords

• Etching
• Microelectronics
• Plasma
• Plasma Processing
• Semiconductor Processing

Digital Object Identifier (DOI)

• 10.1149/2162-8777/abbb71

start page

• 104009

end page

• 104009

volume

• 9

issue

• 10

URL

• http://dx.doi.org/10.1149/2162-8777/abbb71