Phase-Field Study of Thermomigration in 3-D IC Micro Interconnects Academic Article uri icon

published proceedings

  • IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY

author list (cited authors)

  • Attari, V., & Arroyave, R.

citation count

  • 3

complete list of authors

  • Attari, Vahid||Arroyave, Raymundo

publication date

  • January 1, 2020 11:11 AM