Phase-Field Study of Thermomigration in 3-D IC Micro Interconnects
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Overview
published proceedings
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IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY
author list (cited authors)
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Attari, V., & Arroyave, R.
citation count
complete list of authors
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Attari, Vahid||Arroyave, Raymundo
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Research
keywords
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Bonding
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Field Programmable Gate Arrays
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Heating Systems
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Intermetallics
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Low-volume Solder Interconnect (lvi)
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Mathematical Model
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Metals
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Microbumps
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Microstructure
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Phase-field Method
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Thermodynamics
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Thermomigration (tm)
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URL
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http://dx.doi.org/10.1109/tcpmt.2020.2994021