Phase-Field Study of Thermomigration in 3-D IC Micro Interconnects Academic Article

authors

• Arroyave, Raymundo
• Attari, Vahid

published proceedings

• IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY

author list (cited authors)

• Attari, V., & Arroyave, R.

citation count

• 6

complete list of authors

• Attari, Vahid||Arroyave, Raymundo

publication date

• September 2020

publisher

• Institute of Electrical and Electronics Engineers (IEEE)  Publisher

published in

• IEEE Transactions on Components, Packaging and Manufacturing Technology  Journal

keywords

• Bonding
• Field Programmable Gate Arrays
• Heating Systems
• Intermetallics
• Low-volume Solder Interconnect (lvi)
• Mathematical Model
• Metals
• Microbumps
• Microstructure
• Phase-field Method
• Thermodynamics
• Thermomigration (tm)

Digital Object Identifier (DOI)

• 10.1109/TCPMT.2020.2994021

start page

• 1466

end page

• 1473

volume

• 10

issue

• 9

URL

• http://dx.doi.org/10.1109/tcpmt.2020.2994021