A Novel Non-destructive Interfacing Technique for Molecular Scale Switching Junctions
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ABSTRACTCharacterization of molecular scale electronic devices generally involves deposition of a metal top electrode onto an organic film. During the evaporation process, high energetic granules of metals may lead to unwanted reactions between the organic molecules and deposited top electrodes. This can cause, as commonly reported, lasting damage which leaves most junctions either short or open. To overcome this important issue of physical damage to the molecules, we developed a novel technique of interfacing molecules by laying prefabricated metallic electrodes on top of a monolayer of molecules. For the bottom electrode a monolayer of cadmium stearate ((C17H35COO)2Cd) was deposited, using the Langmuir-Blodgett technique, onto platinum (Pt) electrodes which further rested on 200nm of oxide used for isolation. A separate set of Aluminum (Al) electrodes were fabricated on a different oxide free, highly doped substrate and was gently placed on the cadmium stearate monolayer in room ambient. Conduction to the top electrode was accomplished by probing the backside of the highly doped wafer whereas the bottom electrodes were individually addressed. Pressure was applied to ensure firm contact between the molecules and the top electrodes. Preliminary results showed an observed switching voltage of 3.5V. Most of the devices with Al as the top electrodes exhibited a gradual progression from switching on the positive side, closing, and then switching towards the negative side.
