Silicon Based On-Wafer and Discrete Packaging Chapter uri icon

abstract

  • Advanced packaging concepts for three dimension (3-D) microwave monolithic integrated circuits (MMIC’s) are being investigated at The University of Michigan. As high frequency circuit design complexity increases so must the design and development of the housing which supports these components. In the past more emphasis was placed on improving integrated circuit (IC) processing technology while research in the area of electronic packaging was minimal. Now that IC processing technology has reached a mature level and it is possible to fabricate excellent components which function well at high frequencies, it has been determined that circuit/system performance is being limited due to the lack of performance on the part of the electronic package. High frequency circuits require electronic packages which provide excellent electrical, mechanical, and environmental support while remaining non-invasive.

author list (cited authors)

  • Henderson, R. M., & Katehi, L.

citation count

  • 0

editor list (cited editors)

  • Das, N. K., & Bertoni, H. L.

Book Title

  • Directions for the Next Generation of MMIC Devices and Systems

publication date

  • January 1997