Polymer micro-heat-pipe for InP/InGaAs technologies Conference Paper

abstract

• This paper reports a polymer micro-heat-pipe technology suitable for cooling of InP/InGaAs power devices. This technology eliminates the needs for high-temperature wafer-to-wafer bonding and can be carried out at a temperature below 110/spl deg/C. By estimation from the measured data, the effective thermal conductivity of a fabricated micro-heat-pipe suggests that this technology can serve as a potential solution to some thermal management problems in InP/InGaAs processes.

name of conference

• The 10th IEEE International Symposium on Electron Devices for Microwave and Optoelectronic Applications

authors

• Katehi, Linda

published proceedings

• EDMO 2002: 10TH IEEE INTERNATIONAL SYMPOSIUM ON ELECTRON DEVICES FOR MICROWAVE AND OPTOELECTRONIC APPLICATIONS

author list (cited authors)

• Liu, W. Y., Mohammadi, S., Katehi, L., Khalkhali, H., & Kurabayashi, K.

citation count

• 1

complete list of authors

• Liu, WY||Mohammadi, S||Katehi, LPB||Khalkhali, H||Kurabayashi, K

publication date

• January 2002

publisher

• Institute of Electrical and Electronics Engineers (IEEE)  Publisher

keywords

• 40 Engineering
• 4012 Fluid Mechanics And Thermal Engineering

Digital Object Identifier (DOI)

• 10.1109/EDMO.2002.1174945

International Standard Book Number (ISBN) 10

• 0-7803-7530-0

start page

• 143

end page

• 148

URL

• http://dx.doi.org/10.1109/edmo.2002.1174945