RF MEMS and Si micromachining in high frequency applications
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abstract
RF MEMS and Si micromachining are key technologies in obtaining low-size, low-weight, and low-cost components for the coming generation of communications systems. These technologies allow both the development of high-performance microwave/millimeter-wave switches and switch-based tunable subsystems, as well as innovative and efficient architectures for interconnecting and packaging. The design of a low-voltage capacitive and a low-resistance DC-contact switch are discussed. We also focus on a broadband low-loss on-wafer packaging scheme developed for the capacitive MEMS switch.
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Proceedings RAWCON 2002. 2002 IEEE Radio and Wireless Conference (Cat. No.02EX573)