RF MEMS and Si micromachining in high frequency applications Conference Paper uri icon

abstract

  • RF MEMS and Si micromachining are key technologies in obtaining low-size, low-weight, and low-cost components for the coming generation of communications systems. These technologies allow both the development of high-performance microwave/millimeter-wave switches and switch-based tunable subsystems, as well as innovative and efficient architectures for interconnecting and packaging. The design of a low-voltage capacitive and a low-resistance DC-contact switch are discussed. We also focus on a broadband low-loss on-wafer packaging scheme developed for the capacitive MEMS switch.

name of conference

  • Proceedings RAWCON 2002. 2002 IEEE Radio and Wireless Conference (Cat. No.02EX573)

published proceedings

  • RAWCON 2002: IEEE RADIO AND WIRELESS CONFERENCE, PROCEEDINGS

author list (cited authors)

  • Peroulis, D., Margomenos, A., & Katehi, L.

citation count

  • 3

complete list of authors

  • Peroulis, D||Margomenos, A||Katehi, LPB

publication date

  • January 2002