Polymer micro-heat-pipe for InP/InGaAs integrated circuits Conference Paper

abstract

• This paper reports a polymer-based technology suitable for implementation of micro-heat-pipes for low temperature InP/InGaAs based processes. Many published approaches for implementing heat pipes at micro scale require wafer-to-wafer bonding and sintering. The temperature required for standard wafer-to-wafer bonding or sintering is normally in excess of 500/spl deg/C and is beyond the thermal budget of many low temperature InP/InGaAs-based processes. This technology enables a heat-pipe to be miniaturized with mainly organic materials at a temperature below 110/spl deg/C, eliminating the needs for high-temperature wafer-to-wafer bonding and sintering. Measurements have been carried out and are presented to substantiate this presentation.

name of conference

• Ninteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium, 2003.

authors

• Katehi, Linda

published proceedings

• NINETEENTH ANNUAL IEEE SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM

author list (cited authors)

• Liu, W. Y., Mohammadi, S., & Katehi, L.

citation count

• 3

complete list of authors

• Liu, WY||Mohammadi, S||Katehi, LPB

publication date

• January 2003

publisher

• Institute of Electrical and Electronics Engineers (IEEE)  Publisher

published in

• Annual IEEE Semiconductor Thermal Measurement and Management Symposium  Journal

keywords

• Gelcasting
• Heat-pipe
• Microfabrication
• Polymer Micromachining
• Su-8

Digital Object Identifier (DOI)

• 10.1109/STHERM.2003.1194343

International Standard Book Number (ISBN) 10

• 0-7803-7793-1

start page

• 82

end page

• 87

URL

• http://dx.doi.org/10.1109/stherm.2003.1194343