High Frequency Parasitic Effects for On-Wafer Packaging of RF MEMS Switches Conference Paper uri icon


  • A silicon micromachined on-wafer DC to 40 GHz packaging scheme for RF MEMS switches is presented. The designed on-wafer package has an insertion loss which is less than 0.3 dB up to 40 GHz (including a 2.7 mm long through line) and a return loss below -18 dB up to 40 GHz. The inclusion of the bonding ring and the dc bias lines creates parasitic resonances. This paper presents a detailed study of the package parasitics and provides solutions that can effectively eliminate them for frequencies up to 40 GHz.

name of conference

  • IEEE MTT-S International Microwave Symposium - IMS 2003

published proceedings

  • IEEE MTT-S International Microwave Symposium Digest, 2003

author list (cited authors)

  • Margomenos, A., & Katehi, L.

citation count

  • 12

complete list of authors

  • Margomenos, A||Katehi, LPB

publication date

  • January 2003