Three dimensional integration and on-wafer packaging of signal centric sensors for ultra wideband systems Conference Paper uri icon

abstract

  • Future military and commercial communication systems and sensors will require a new generation of circuits with cognitive, deployable, agile, versatile, survivable and sustainable capabilities. The requirement to accommodate arbitrary-bandwidth signals, poses significant challenges to traditional time-invariant matching networks because of the gain-bandwidth restrictions and their inability to ensure a linear phase response for broadband pulse-based inputs (Bode, 1945). To address this need we propose in this paper a time-variant matching network particularly suited for pulse-based systems that is capable of accommodating high-Q RC loads.

name of conference

  • 2007 IEEE Antennas and Propagation Society International Symposium

published proceedings

  • 2007 IEEE Antennas and Propagation Society International Symposium

author list (cited authors)

  • Xin Wang, .., Katehi, L., Peroulis, D., & Perlman, B.

citation count

  • 0

complete list of authors

  • Katehi, Linda||Peroulis, Dimitris||Perlman, Barry

publication date

  • June 2007

publisher