Toward a novel planar circuit compatible silicon micromachined waveguide Conference Paper

abstract

• A novel, completely packaged planar-fed silicon micromachined waveguide/resonator is proposed. Simulated results for a Ka-band resonator are given, along with initial results of the required three-dimensional photolithographic patterning along sloping sidewalls.

name of conference

• IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412)

authors

• Katehi, Linda

published proceedings

• IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412)

author list (cited authors)

• Becker, J. P., & Katehi, L.

citation count

• 10

complete list of authors

• Becker, JP||Katehi, LPB

publication date

• January 1999

publisher

• Institute of Electrical and Electronics Engineers (IEEE)  Publisher

keywords

• 3d Photolithographic Patterning
• Anisotropic Magnetoresistance
• Cavity Resonators
• Circuits
• Dielectric Losses
• Electromagnetic Waveguides
• Elemental Semiconductors
• Etching
• Ka-band Resonator
• Micromachining
• Packaged Planar-fed Silicon Micromachined Waveguide/resonator
• Photolithography
• Planar Circuit Compatible Silicon Micromachined Waveguide
• Planar Transmission Lines
• Planar Waveguides
• Rectangular Waveguides
• Resists
• Semiconductor Device Packaging
• Si
• Silicon
• Simulation
• Sloping Sidewalls
• Waveguide Transitions
• Waveguides

Digital Object Identifier (DOI)

• 10.1109/epep.1999.819230

start page

• 221

end page

• 224

URL

• http://dx.doi.org/10.1109/epep.1999.819230