W-Band Micromachined Vertical Interconnection for Three-Dimensional Microwave ICs Conference Paper

abstract

• A novel vertical interconnection utilizing finite ground coplanar waveguide (FGCPW) and silicon micromachining has been developed for W-band The measured results indicate insertion loss of only 0.6 dB. This transition uses standard processing techniques and is a compact, 520 m width and 520 m length, design. With this vertical interconnect, multiple IC layers may be connected to achieve new levels of high density, low loss integration.

name of conference

• 1999 29th European Microwave Conference

authors

• Katehi, Linda

published proceedings

• 1999 29th European Microwave Conference

author list (cited authors)

• Henick, K. J., Yook, J., Robertson, S. V., Rebeiz, G. M., & Katehi, L.

citation count

• 2

complete list of authors

• Henick, Katherine J||Yook, Jong-Gwan||Robertson, Stephen V||Rebeiz, Gabriel M||Katehi, Linda PB

publication date

• October 1999

publisher

• Institute of Electrical and Electronics Engineers (IEEE)  Publisher

keywords

• Conductors
• Etching
• Fabrication
• Frequency
• Gold
• Integrated Circuit Interconnections
• Micromachining
• Microwave Filters
• Millimeter Wave Technology
• Silicon

Digital Object Identifier (DOI)

• 10.1109/euma.1999.338477

start page

• 402

end page

• 406

volume

• 3

URL

• http://dx.doi.org/10.1109/euma.1999.338477