The Effects of Si-Micromachined On-Wafer Packaging on the Performance of K-Band Circuits Conference Paper uri icon

abstract

  • This paper presents results from a study on the effect of Si-micromachined packaging on the performance of K-band circuits. Components inclduding interconnects and stubs have been fabricated using finite ground coplanar (FGC) transmission lines and results indicate that nonmetalized air cavities introduce fewer parasitics as compared to metalized air cavities. Flip-chip devices have been incorporated to design a packaged 3-stage low noise amplifier (LNA). The performance of flip-chip Indium Phosphide (InP) high electron mobility trnsistors (HEMTs) in the host substrate environment is measured and used to design the packaged LNA for desired performance.

name of conference

  • 29th European Microwave Conference, 1999

published proceedings

  • 29th European Microwave Conference, 1999

author list (cited authors)

  • Henderson, R. M., Schwarz, T. A., Robertson, S. V., Katehi, L., Case, M., & Matloubian, M.

citation count

  • 0

complete list of authors

  • Henderson, Rashaunda M||Schwarz, Thomas A||Robertson, Stephen V||Katehi, Linda PB||Case, Michael||Matloubian, Mehran

publication date

  • October 1999