Three-dimensional high-frequency distribution networks. II. Packaging and integration
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This paper describes the implementation and packaging of the components, described in Part I of this paper, to realize a three-dimensional W-band distribution network.
IEEE Transactions on Microwave Theory and Techniques
author list (cited authors)
Henderson, R. M., Herrick, K. J., Weller, T. M., Robertson, S. V., Kihm, R. T., & Katehi, L.
complete list of authors
Henderson, RM||Herrick, KJ||Weller, TM||Robertson, SV||Kihm, RT||Katehi, LPB