Three-dimensional high-frequency distribution networks. II. Packaging and integration Academic Article uri icon

abstract

  • This paper describes the implementation and packaging of the components, described in Part I of this paper, to realize a three-dimensional W-band distribution network.

published proceedings

  • IEEE Transactions on Microwave Theory and Techniques

author list (cited authors)

  • Henderson, R. M., Herrick, K. J., Weller, T. M., Robertson, S. V., Kihm, R. T., & Katehi, L.

citation count

  • 23

complete list of authors

  • Henderson, RM||Herrick, KJ||Weller, TM||Robertson, SV||Kihm, RT||Katehi, LPB

publication date

  • January 2000