Three-dimensional high-frequency distribution networks - Part II: Packaging and integration

abstract

• This paper describes the implementation and packaging of the components, described in Part I of this paper, to realize a three-dimensional W-band distribution network.

authors

• Katehi, Linda

published proceedings

• IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES

author list (cited authors)

• Henderson, R. M., Herrick, K. J., Weller, T. M., Robertson, S. V., Kihm, R. T., & Katehi, L.

citation count

• 24

complete list of authors

• Henderson, RM||Herrick, KJ||Weller, TM||Robertson, SV||Kihm, RT||Katehi, LPB

publication date

• January 2000

publisher

• Institute of Electrical and Electronics Engineers (IEEE)  Publisher

published in

• IEEE Transactions on Microwave Theory and Techniques  Journal

keywords

• Coplanar Transmission Lines
• Micromachining
• Microwave Circuits

Digital Object Identifier (DOI)

• 10.1109/22.873891

start page

• 1643

end page

• 1651

volume

• 48

issue

• 10

URL

• http://dx.doi.org/10.1109/22.873891